PCB Designing

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PCB Designing Certification Training

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The primary focus of softpro’s PCB (Printed Circuit Board) designing is an integral part of each electronics products and this program is designed to make students capable to design their own projects PCB up to industrial grade.

You will Learn:
Voltage & Current Practical Approach, Resistors & Colour Coding, Diodes, Regulator ICs, Transistors, Power Supply, Motor & Motor Drivers, Relay & Relay Drivers, Wireless Transmitters & Receivers, DTMF Technology, Comparator IC And its application etc.

5/5 Ratings
1,400 trainees
from 250+ Colleges

Industry standard projects
and assignments

Curriculum by experts
Designed by top professionals with 10+ years of experience

Training Includes:

Basic Electronics

Schematic Designing

24x7 Tech Support

Layout Designing

PCB Fabrication

Live Projects

Start Learning !

  Course Curriculum

a. Voltage & Current Practical Approach
b. Resistors & Colour Coding
c. Diodes
d. Regulator ICs
e. Transistors
f. Power Supply
g. Motor & Motor Drivers
h. Relay & Relay Drivers
i. Wireless Transmitters & Receivers
j. DTMF Technology
h. Comparator IC And its application

a. What is PCB
b. Difference between PWB and PCB
c. Types of PCBs
        a. Single Sided (Single Layer)
        b. Multi-Layer (Double Layer)
d. PCB Materials

a. Older PCB Method
b. PCB Designing Using Graph Paper
c. Making a hand drawn PCB
d. Using Computer for EDA

a. Brief History of EDA
b. Latest Trends in Market
c. How it helps and Why it requires
d. Different EDA tools
e. Introduction to SPICE and PSPICE Environment
f. Introduction and Working of PROTEUS

a. Active Components b. Diode
c. Transistor
e. LED
f. SCR
g. Integrated Circuits (IC’s)
h. Passive Components
i. Resistor
j. Capacitor
k. Inductor
l. Transformer
m. Speaker/Buzzer

a. Through Hole Packages
b. Axial lead
c. Radial Lead
d. Single Inline Package(SIP)
e. Dual Inline Package(DIP)
f. Transistor Outline(TO)
g. Pin Grid Array(PGA)
h. Through Hole Packages
i. Metal Electrode Face(MELF)
j. Leadless Chip Carrier(LCC)
k. Small Outline Integrated Circuit(SOIC)
l. Quad Flat Pack(QPF) and Thin QFP (TQFP)
m. Ball Grid Array(BGA)
n. Plastic Leaded Chip Carrier(PLCC)

a. Brief Introduction of various simulators
b. Description to Proteus ISIS simulator tool
c. Hands on practice on available library of components
d. working through wiring and schematic designing
e. Making New Component Symbols

a. Connecting the schematic From ISIS to ARES b. Selecting the Components Footprints as per design c. Picking and placing the Component d. Making New Footprints e. Assigning Footprint to components

a. Schematic Entry
b. PCB Layout Designing
c. Prototype Designing
d. Design Rule Check(DRC)
e. Design For Manufacturing(DFM)
f. PCB Making
g. Printing
h. Etching
i. Drilling
j. Assembly of components

a. Electrical Layers b. Top Layer c. Mid Layer d. Bottom Layer e. Mechanical Layers f. Board Outlines and Cutouts g. Drill Details h. Documentation Layers i. Components Outlines j. Reference Designation h. Text

a. Printing the Design
b. Etching
c. Drilling
d. Interconnecting and Packaging electronic Circuits (IPC) Standards
e. Gerber Generation
f. Soldering and De-soldering
g. Component Mounting
h. PCB and Hardware Testing

a. Making the schematic of Academic and Industrial projects b. PCB Designing of these projects c. Soldering and De-soldering of components as per Design d. Testing and Trouble-shooting Methods e. Description of Project Development Process f. Project Discussion & Allotment g. Synopsis Making & Submission h. Practice of De-Soldering & Soldering i. Introduction to Hardware Techniques j. Project Completion k. Detailed Project Report Submission l. Final Project PPT m. Feedback Submission n. Certification Distribution


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